Inspection - Semiconductor - TZTEK, Devoted to Smart Industry

Macro Defect Inspection

HIGH THROUPUT MACRO DEFECT INSPECTIONMueTec’s Macro Defect Inspection products are designed for customers with many different wafer types. The system is easy to operate and does not require to write any recipes. It also enables 100% inspection of all wafer during the process of lithography with a throughput that is equal to, or faster that of a lithography cluster. In consequence, we enable our customers to move from sample inspection to inspection of all wafer and from manual inspection by operators to a statistically reliable, automated inspection process. Our tools can easily be setup without using much floor space. Low acquisition and operating costs guarantee a fast return on invest.SIGNIFICANT ADVANTAGES Enabling 100% wafer inspection at lithography√ Throughput 200 wafer per hour√ No recipe required for ease of use√ Replaces manual inspection√ Simulaneous wafer frontside and backside inspection√ Highly cost effective solution for fast return on invesHIGH RESOLUTION MACRO DEFECT INSPECTIONFor customers with higher resolution requirements, MueTec provides a high resolution macro defect inspection solution down to 1μm. SIGNIFICANT ADVANTAGES √ Recipe-less algorithm: Ideal for wafer fabs with many different product types√ Cost effective - replaces manual inspection√ Two simultaneous illumination modes (bright field, dark field)√ Throughput of 50 wph at 2µm/pixel resolution√ 300mm FOUP or 200mm SMIF version availableMueTec’s inspection solution for outgoing process control of the sawing process includes all areas of the framed wafer on foil. This includes the inspection of the sawing lines, as well as scratches, cracks, missing dies and particles. The inspection algorithm follows the recipe-free approach of the Argos product family. Many different product types can be inspected without creating specific recipes. P0ST-SAWN FRAMED WAFER INSPECTIONKEY FEATURES√ 380 mm framed wafer FOUP based handling√ Optimized for multi-zone inspection of wafer, foil and frame. Detected defects include: Sawing line failures Cracks Scratches Bubbles in foil on frame and wafer Holes in foil Etc.√ Data acquisition perfectly balanced to mechanical movements√ Simultaneous brightfield and dark field inspectionNO RECIPE REQUIRED FOR EASE OF USE:√ Enables productivity gains through minimum recipe customization√ Ideal for fabs and packaging areas with many different devices & die sizes√ No learning of alignment marks, chip size or wafer center necessary. Die layout data is not necessary√ Recognition of active die area and EBR zone√ Different sensitivities for different wafer areas√ Avoiding false positives at zone transitions√ Automatic adjustment of light intensity√ Reflectivity of inspected layer is not necessary√ Automatic defect recognition parameters by adaptive software algorithm

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Micro Defect Inspection

MueTec has a long-standing experience in providing customized soft- and hardware solutions for in-situ defect identification on regular or irregular structures, employing advanced pattern recognition, object analysis, object modeling, and object filtering algorithms. On request, customized programming solutions allow for a cost-effective implementation of almost any substrate analysis.SIGNIFICANT ADVANTAGES√ MueTec tools are expandable for Defect Inspection purposes√ Mostly it is only a question of software extension√ Leading to reasonably Cost of OwnershipAutomated defect inspection is usually based on the so called “golden image principle”: images of various substrates are compared to a pre-produced template image, ”the golden image” to identify defects for subsequent analysis and classification. MueTec offers a wide range of software tools exploiting this principle for semi-automated as well as fully automated defect inspection. Many industrial applications however do not allow for the “golden image” approach due to throughput constraints or, more often, due to the high variability in the substrate design and substrate processing.The MueTec proprietary Smart Defect Inspection (SDI) algorithm is no longer dependent on wafer-to-wafer process variations because the “golden image” calculation for each wafer is performed as soon as enough dies have been analyzed.WHAT IS DEFECT SCANNING (OR SUBSTRATE SCANNING)?Defect scanning (or substrate scanning) describes an operation that completely images a selected area of a substrate or the complete substrate as a set of sub images. The scanning stage moves continuously either in the y- or x-direction and all CCD images are stored for defect evaluation. Stage speed and camera shot frequency are synchronized to guarantee that all areas of interest are covered. Cluster PCs process the images on-the-fly and handle a multitude of desired data evaluations. Freely adjustable filters defining e.g. defect size, defect area, defect morphology, location of the defect within the die or substrate ensure the flexibility of defect classification (defect type, defect severity) on any substrate.MueTec supports die-to-die inspection with unlimited die size and even covers complete wafer comparison.

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Infrared (IR) Inspection

Silicon, GaAs wafers and other substrates become transparent at infrared (IR) wavelengths. High performance IR optics in combination with a high efficiency InGaAs camera provide images with superior resolution and contrast.ADVANTAGES OF MUETEC SOLUTIONS√ The optics are designed and optimized for the IR range from 1050 to 1550nm including IR optimized objective lenses with selectable magnifications from 2.5x, 5x, 10x, 20x, 63x, 100x.√ The high resolution InGaAs-camera guarantees best image resolution and highest contrast images.√ The IR optimized illumination path can be switched to incident and/or transmitted light.√ A combination of IR & visible light inspection is supported.√ The autofocus can be chosen between real-time laser autofocus or the highly intelligent fast image autofocus√ The best-in-class technology ensures worldwide leading edge performance regarding accuracy, repeatability and throughput.SEALING INSPECTION FOR MEMSWith the illumination source adjusted to your application requirements (1050nm - 1550nm), IRIS2100/IRIS2300 automatically detects smallest details such as bubbles and breaches that effect the functionality of the device. This advanced technology, in combination with our IR optimized software solution also detects delamination and eutectic bonding failures.DEVICE DEFECT INSPECTIONIRIS2100/IRIS2300 enables you to detect and classify contamination and damages in the active device area. Our patented combination of visible and infrared illumination allows you to distinguish surface defects from defects deep inside the substrate.

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Mask Inspection

HIGH THROUPUT MACRO DEFECT INSPECTIONMueTec’s mask inspection is using a die-to-die approach to detect statistical failures on the mask. This tool is used to monitor the masks in wafer manufacturing, typically in power semiconductor, LED and MEMS manufacturing.Our tool helps the customer to automatically decide if the photomask is good, requires cleaning or needs to be replaced.

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